Papers
Understanding 'tombstoning' and how to prevent it Harry Trip Published in Dataweek.co.za
?Pause? for Better Solder Paste Printing Harry Trip Published in circuitnet.com (pdf)
Tips for Preventing ?Tombstoning? of Chip Components Harry Trip Published in circuitnet.com (pdf)
The persistent Problem of Tombstoning
Harry Trip, 2003 Published in Circuits Assembly, June 2003
Kosteneffizientes Testverfahren zur QS von Lotpasten Ineke van Tiggelen-Aarden, 2003 Published in Productronic (in 3 parts in the German language), November/December 2003, March 2004 Slump and Tackiness Testing Using Rheometry Ineke van Tiggelen-Aarden, 2004 Published in Surface Mount Technology (SMT), June 2004
A fast, precise and reproducible QC-rheometry routine for solder paste Ineke van Tiggelen-Aarden, 2004 Published in Global SMT & Packaging , August/Sept 2004 Oxidation and Topography of Powder in Pb-free Solder Paste Ineke van Tiggelen-Aarden & Eli Westerlaken, 2005 Proceedings APEX, February 2005 Powder Challenges in Pb-Free Solder Paste Ineke van Tiggelen-Aarden & Eli Westerlaken, 2005 Published in OnBoard Technology (pdf) Solder Materials for Lead-free Technology Lance Larrabee, Ineke van Tiggelen-Aarden & Eli Westerlaken, 2005 Published in EM Asia, November 2005 Running Pb-Free Reflow Profiles without N2 Eli Westerlaken, 2006 Published in Circuits Assembly may 2006
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