Solder Materials under ISO/TS 16949
According to the requirements put forward in the PPAP, 4th Edition, March 2006, Appendix F, page 35, Section F2, Applicability, 3rd Paragraph, solder materials are considered as Bulk materials.
Section 2.2, PPAP Requirements, page 3: Bulk Material PPAP requirements are defined by a completed Bulk Material Requirements Checklist (See table for Checklist Items)
Introduction, Applicability, page 1: For Bulk Material, PPAP is not required unless specified by the authorized customer representative.
Section F12, Parts Submission Warrant, page 49, stipulates that there is no need to prepare a Part Submission Warrant if a customer agrees that a PPAP is not required.
Section F4.1, page 37: A Design Matrix, when required, shall be prepared prior to developing or assigning a Design FMEA.
For Bulk Material, production histories of current products may often be used to estimate the initial process capability or performance of new or similar products.
Section 2.1, Significant Production Run, For Bulk Materials, page 3: No specific number of “parts” is required. The sample shall be taken in a manner as to assure that it represents “steady state” operation of the process.

Solder materials undergo chemical and physical transformations. The latter implies the necessity of including User's Guidelines in the PPAP-package to support a Customer Plant Connection (Section F14.1, page 53).
Section F9, page 46, acknowledges the larger measurement variability for properties (such as viscosity) in the process industry, accounting in some cases for 50% or more of the total variation. Therefore Cobar has adjusted the 10 and 30% limits used for mechanical parts to respectively 30 and 65% for MSA-studies. MSA-studies will be applied to any of the Special Characteristics or Key Product Parameters.
The shelf-life nature of the major part of the solder materials requires the use of a Manufacturing Sample Record (Section F11.1, page 47). Due to the proprietary nature of the record, detailed information cannot be submitted unless the customer has signed a Non-Disclosure Agreement. The offer of a Non-Disclosure Agreement will only be accepted under certain conditions, amongst which the transaction of substantial quantities of the product concerned.
In analogy with the statements in PPAP, 4th Edition, March 2006, Appendix G, page 55, applicable to the Tire industry, the following conditions furthermore apply to solder materials:
  • Solder materials are not an appearance item for the OEMs, consequently the AAR requirement is not applicable. (Reference 2.2.13)
  • Master Samples are not retained (References 2.2.15 & 2.2.9)
  • Evidence of testing as provided in the PPAP-package is applicable only to finished products and not to raw materials. (Reference 2.2.10)
  • Generic documents for families of similar materials may be applied to: (Reference 2.2.5) 
       o Process Flow Charts 
       o Design FMEAs 
       o Process FMEAs 
       o Control Plans
  • Checking Aids for solder materials are not required by the industry. (Reference 2.2.16)