Dispense | | English |  | |
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You can choose a product by clicking on the productname in the productmatrix.  | Especially made for this purpose |  | Generally qualified for this purpose |  | Generally usable, but not the best choice |  | Generally not usable for this purpose |  | Wrong choice |
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| No-Clean process | | | | Post-solder cleaning | | | | Pb-Free process - Air, Standard | | | | Pb-Free process - Air, Extended | | | | Pb-Free process - N2 | | | | Vapor Phase | | | | Consumer electronics | | | | Mid-Rel electronics | | | | Hi-Rel electronics | | | | OSP compatible | | | | Ni/Au compatibel | | | | Ni/Pd compatible | | | | Ag compatible | | | | Sn compatible | | | | Automatic Hi-Speed Dispensing | | | | Manual Dispensing | | | | Fine-pitch (=< 0.625 mm) | | | | Reduces solder balling | | | | Reduces solder beading | | | | Reduces bridging | | | | Reduces tombstoning | | | | Reduces de-wetting | | | | Brilliant joint appearance | | | | Cosmetic cleanliness | | | | Reduces flux build-up in reflow oven | | | | ICCT compatible | | | | Conformal coating | | |
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