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Product Data Sheet
English
Product
390
Productgroup
General Wave Solder Flux
Date
19-09-2006
Release
6.1
Especially made for this purpose
Generally qualified for this purpose
Generally usable, but not the best choice
Generally not usable for this purpose
Wrong choice
ISO 9454-1
1.2.3.A
IPC-ANSI-J-STD-004
REL0
JIS Z 3197
1.2.3.N_I
No-Clean process
Post-solder cleaning
Selective Soldering
Pb-Free process - Ambient
Pb-Free process - N2
N2 Process - Full Tunnel
N2 Process - Wave Only
Consumer electronics
Mid-Rel electronics
Hi-Rel electronics
1-layer, video/tv boards
2-layer boards
Multi-layer boards
OSP compatible
Ni/Au compatibel
Ni/Pd compatible
Ag compatible
Sn compatible
Foam fluxing
Nozzle-spray fluxing
Moderate preheat
Short contact time with solder
Reduces skipped joints
Reduces solder balling
Reduces bridging
Promotes wicking
Cosmetic cleanliness
Cosmetic cleanliness N2
Dull/frosty joints
ICCT compatible
Conformal coating
SG @ 20 °C [kg/dm3] (+/- 0.5%)
0.843
Solids content [% w/w]
2.11
Halides [Silver-Chromate Test]
Pass
Halides [Potentiometric]
Pass
Acid number [mgKOH] (+/-2.5%)
15.28
Water content [% w/w]
0.
VOC-content [% w/w]***
97.00
Filmformer(s)
Synthetic
Flashpoint COC [°C]
11.2
Odor
Alcoholic
Color
Colorless
Telcordia/Bellcore TR-NWT-000078/3
Qualified
IPC/ANSI-J-STD-005
Qualified
Test report(s)
-
ISO-TS-16949 (IATF nummer)
0043973
Certificate of Compliance
Available
SPC-data*
Auditable
Environmental Load Unit**
6.20
RoHS-Compliance Certificate
Available
User's Guidelines
English
Thinner
309-00
Packaging
Can (HDPE) [liter]
10
Drum (HDPE) [liter]
200
Shelf-life (Weeks)
Storage 20 [°C]
52.
Storage 25 [°C]
40.
*Certain conditions apply.
**See www.cobar.com/QMS for further details.
***Having a vapor pressure of >0.01 mm Hg @ 25 °C
Industrial chemical product. Read MSDS before use.
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| © 2006 All rights reserved | Last update on 02-08-2010