Product Data Sheet
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Product398
ProductgroupGeneral Wave Solder Flux
Date19-09-2006
Release6.1
 
Especially made for this purpose
Generally qualified for this purpose
Generally usable, but not the best choice
Generally not usable for this purpose
Wrong choice
ISO 9454-11.2.3.A
IPC-ANSI-J-STD-004REL0
JIS Z 31971.2.3.N_I
No-Clean process
Post-solder cleaning
Selective Soldering
Pb-Free process - Ambient
Pb-Free process - N2
N2 Process - Full Tunnel
N2 Process - Wave Only
Consumer electronics
Mid-Rel electronics
Hi-Rel electronics
1-layer, video/tv boards
2-layer boards
Multi-layer boards
OSP compatible
Ni/Au compatibel
Ni/Pd compatible
Ag compatible
Sn compatible
Foam fluxing
Nozzle-spray fluxing
Moderate preheat
Short contact time with solder
Reduces skipped joints
Reduces solder balling
Reduces bridging
Promotes wicking
Cosmetic cleanliness
Cosmetic cleanliness N2
Dull/frosty joints
ICCT compatible
Conformal coating
SG @ 20 °C [kg/dm3] (+/- 0.5%)0.837
Solids content [% w/w]1.11
Halides [Silver-Chromate Test]Pass
Halides [Potentiometric]Pass
Acid number [mgKOH] (+/-2.5%)8.15
Water content [% w/w]0.
VOC-content [% w/w]***98.00
Filmformer(s)Synthetic
Flashpoint COC [°C]11.0
OdorAlcoholic
ColorColorless
Telcordia/Bellcore TR-NWT-000078/3Qualified
IPC/ANSI-J-STD-005Qualified
Test report(s)-
ISO-TS-16949 (IATF nummer)0043973
Certificate of ComplianceAvailable
SPC-data*Auditable
Environmental Load Unit**6.30
RoHS-Compliance CertificateAvailable
User's GuidelinesEnglish
Thinner309-00
Packaging
Can (HDPE) [liter]10
Drum (HDPE) [liter]200
Shelf-life (Weeks)
Storage 20 [°C]52.
Storage 25 [°C]40.
*Certain conditions apply.
**See www.cobar.com/QMS for further details.
***Having a vapor pressure of >0.01 mm Hg @ 25 °C
Industrial chemical product. Read MSDS before use.