Process Technology Support
VOC-Free Technology
PB-Free Technology
RoHs Compliance Certification
Preferred Alloys
SAC-Alloys, Physical Properties
Process Window
Critical Issues
Board Metalizations
Lay-out Rules
Components
SMT-process
Wave Solder process
Acceptance Criteria
Reflow/Soldering in N2 Atmosphere
PB-Free Troubleshooting
General
Pb-Free Reflow
PB-Free Wave Soldering
Process Support
General Issues
General Process Considerations
Process Window
SPC
RoHs Compliance Certification
Preferred Alloys Pb-Free
SAC-Alloys, Physical Properties
Critical Issues Pb-Free Technology
International Standards
Acceptance Criteria
Inspection
Components & Placement
Board Design
THT/ Wave Soldering
Fluxes
Incoming Inspection/ QA fluxes
General Wave Soldering
Selective Soldering
SMT/Reflow Soldering Paste
Pb-Free Technology
Solder paste Composition
Solder Paste Powder
Flow Properties
Solder Paste Flux
Rheometry
Thermal Properties
Lead-Free paste
Selecting a paste
QA incoming
Working disciplines
SMT/Reflow Printing
Process control
Stencils
Squeegees
Direct Imaging
Board support
Parameters
Board Criteria
Printing Process
Acceptance Criteria
Paste Consumption
SMT/Reflow Dispensing
Applications
Feeder
Needles
Z-Axis
Board criteria 1
Board criteria 2
Parameters
Perfect dot
SMT/Reflow Pin-in-Paste
Methods
SMT/Reflow Process
General
Equipment
Profiling
Acceptance Criteria
Perfect Joints
SMT/ Reflow ICCT Testing
Manual Soldering
Coming soon
Robot Soldering
Coming soon
Troubleshooting
Component Placement
Reflow Soldering
Wave Soldering
Pb-Free, General
Cleaning
General
Equipment
Health & Safety
Environmental Issues
Requirements
Working Disciplines Wave Soldering
Receiving / Storage
• Store wave solder fluxes upon arrival:
• Temperature < 20 ēC / 68 ēF
• Maintain FIFO discipline

Incoming Inspection
• Require Certificates of compliance on every batch
• Perform in-house testing
• Maintain Statistical data

Handling / Use
• Shake flux pails before opening packaging
• Keep packaging closed when not used
• Follow User's Guidelines
• Read MSDS
• Keep working area, equipment & tools tidy and clean
• Wear gloves when handling assemblies
• Define and monitor solder defects in SPC-files
• Verify preheat-profile with a mole on a periodic basis
• Maintain & Calibrate the equipment according to the planning
• Monitor Maintenance & Calibration data, including mole data in SPC-files