Process Technology Support
VOC-Free Technology
PB-Free Technology
RoHs Compliance Certification
Preferred Alloys
SAC-Alloys, Physical Properties
Process Window
Critical Issues
Board Metalizations
Lay-out Rules
Components
SMT-process
Wave Solder process
Acceptance Criteria
Reflow/Soldering in N2 Atmosphere
PB-Free Troubleshooting
General
Pb-Free Reflow
PB-Free Wave Soldering
Process Support
General Issues
General Process Considerations
Process Window
SPC
RoHs Compliance Certification
Preferred Alloys Pb-Free
SAC-Alloys, Physical Properties
Critical Issues Pb-Free Technology
International Standards
Acceptance Criteria
Inspection
Components & Placement
Board Design
THT/ Wave Soldering
Fluxes
Incoming Inspection/ QA fluxes
General Wave Soldering
Selective Soldering
SMT/Reflow Soldering Paste
Pb-Free Technology
Solder paste Composition
Solder Paste Powder
Flow Properties
Solder Paste Flux
Rheometry
Thermal Properties
Lead-Free paste
Selecting a paste
QA incoming
Working disciplines
SMT/Reflow Printing
Process control
Stencils
Squeegees
Direct Imaging
Board support
Parameters
Board Criteria
Printing Process
Acceptance Criteria
Paste Consumption
SMT/Reflow Dispensing
Applications
Feeder
Needles
Z-Axis
Board criteria 1
Board criteria 2
Parameters
Perfect dot
SMT/Reflow Pin-in-Paste
Methods
SMT/Reflow Process
General
Equipment
Profiling
Acceptance Criteria
Perfect Joints
SMT/ Reflow ICCT Testing
Manual Soldering
Coming soon
Robot Soldering
Coming soon
Troubleshooting
Component Placement
Reflow Soldering
Wave Soldering
Pb-Free, General
Cleaning
General
Equipment
Health & Safety
Environmental Issues
Requirements
Health & Safety
  • Read material safety data sheets & user's guidelines before working with the solder paste for the first time
  • Wear gloves when working with solder paste
    • Paste remaining under fingernails may accidentally be ingested when consuming food.
    • Solder paste may also penetrate the human body through contact with mucous membranes.
    • Solvents in solder pastes may sensitize the skin. 
  • When soldering avoid breathing fumes
    • Flush reflow equipment with ample quantities of air and exhaust properly prior to opening the equipment.
  •  When cleaning reflow equipment wear gloves and arrange adequate exhaust. 
  •  Special warning for lead containing solder paste
    • Overexposure to lead may cause damage to blood, bone marrow, nervous, reproductive, urinary and intestinal systems. 
  •  A periodic check for lead-content in blood or hair samples of employees working with solder paste may be advisable.